Virscient is heading to Embedded World - and we’re bringing the fun stuff
If you’re coming to Embedded World Nuremberg (March 10–12, 2026),
make sure you swing by Booth 4-549.
Our global team from New Zealand, the US, and Europe are joining forces in Hall 4 to showcase what we’ve been building at the sharp end of wireless connectivity, audio product development, and device certification.
But this isn’t a “come see our brochure” kind of booth.
This is the kind where you can get into the weeds with engineers who’ve had to make systems behave in the real world — where latency budgets, noisy RF environments, battery constraints, and certification headaches aren’t theoretical… they’re BAU.
Why Embedded World?
Because Embedded World is where the best conversations happen.
The kind where people stop talking features and start talking trade-offs. Where “it works in the lab” isn’t good enough. Where the questions sound like:
“What’s your end-to-end latency, in real environments?”
“How are you handling coexistence under load?”
“What does the certification path look like for this novel solution?”
“Can we prototype the full device + app experience fast enough to hit our roadmap?”
These are the questions we love to answer.
As Rick Walker, Head of Sales, puts it:
“This is where conversations go beyond product specs—where engineers, architects, and product leaders can talk tech at the level that really moves the industry forward.”
What We’re Bringing
On the floor this year, we’re showcasing our expertise across audio, automotive and industrial IoT:
SonicBoom: Qualcomm-based audio prototyping in 10 working days. If you’ve ever tried to get from “idea” to a working, end-to-end audio prototype (device plus app), you know how quickly timelines blow out.
LiveOnAir: our proprietary ultra-low latency digital wireless audio protocol, supporting mono, stereo, and multi-channel high-definition audio — with analogue-to-analogue latency that’s tuneable down to 3.5 milliseconds.
Bluetooth for real-time automotive suspension control – we’ll be sharing a system developed for Fox Factory, where the mobile app-connected solution delivers high-performance throughput, latency, plus telemetry streaming to the cloud.
- Automotive Instrument PoC – we’re presenting a new connected-vehicle digital instrument panel PoC, created in collaboration with Infineon on their Traveo™ T2G MCU.
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Animal health management + wireless compliance via CERTify – we’ll be highlighting an animal health management system delivered for Farmfit, incorporating internal boluses, data collectors, and analysis hubs — and certified using our packaged service for managing wireless device compliance.
- Ubiquios – our embedded software system for Infineon AIROC™ Wi-Fi and Bluetooth, built around a building-block approach so you can combine transceivers, MCUs, and application logic cleanly and efficiently — ideal for low-power wireless monitoring use cases like AirSuite.
Let’s talk
Embedded World is about the ecosystem: silicon and component vendors, OEMs, product teams, and partners — all solving different pieces of the same puzzle.
We’ll be there to connect, compare notes, and delve into the technical details that actually impact your speed to market AND your product’s competitive advantage.
So if you’re attending Embedded World Nuremberg, March 10–12, come find us at Booth 4-549 — and bring your hardest questions.
Contact
Are you coming to Embedded World?
Book a visit with Virscient today.