STMicroelectronics

Thumb

Virscient provides design support for development of advanced vehicular telematics solutions using STMicroelectronics' Telemaco3P telematics and connectivity microprocessor.

Virscient is STMicroelectronics' design partner for vehicular telematics solutions based on ST's Telemaco3P telematics and connectivity microprocessor. The Telemaco3P incorporates dual Arm® Cortex®-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces. With security at its core, and considerable flexibility in both hardware and software configurations, the Telemaco3P provides an excellent platform for connectivity within the vehicular environment.

Virscient's deep understanding of wireless connectivity technologies and protocols allows us to architect secure connected-car systems that rely on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

STMicroelectronics Telemaco3P Modular Telematics Platform (MTP)

Virscient offers rapid prototyping of advanced automotive applications using ST's Modular Telematics Platform (MTP). MTP is a comprehensive development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor that enables the development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles.

With proof of concept established, Virscient can support all aspects of your custom Telemaco3P design, from system and PCB engineering, to software development, validation, and certification.

Learn more about the Telemaco3P solution here, and contact us to find out how Virscient can help accelerate development of your telematics solution.